SEMI: SEMICON Taiwan 2026 to Spotlight Advanced Packaging, Smart Manufacturing, and Chiplets
SEMI announced that SEMICON Taiwan 2026 will focus on AI, advanced processes, advanced packaging, and smart manufacturing.
SEMI has identified advanced packaging, smart fabs, quantum technology, and chiplets as key focus areas for the event, reflecting that industry competition is shifting from individual process nodes to system-level integration and manufacturing collaboration.
Source: SEMI
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